Qualcomm has unveiled the Qualcomm S5 and S3 Gen 2 sound platforms, chips intended to power a range of Bluetooth audio products, including high-end and mid-range earbuds, as well as Bluetooth speakers. The big new feature is Dynamic Head Tracking for Spatial Audio, which maintains the perceived positions of sounds as you move your head. Other updates in the Gen 2 chips include improved lossless music streaming and 48ms latency between phone and earbud for lag-free gaming. The chips also fully support Bluetooth Auracast, the new broadcast feature of LE Audio that allows many people to simultaneously listen to a single audio source. Snapdragon Sound features like Dynamic Head Tracking for Spatial Audio are optimized to work with newer Snapdragon chips in phones, such as the Snapdragon 8 Gen 2 that was announced yesterday. Commercial products based on the new chips are expected in the second half of 2023.
from Phone Scoop - Latest News https://ift.tt/B9xzCUS
No comments:
Post a Comment